Samsung Touts Progress on Next-Gen HBM4 Chips, Wins Customer Praise

Samsung

Samsung Electronics announced on Friday that it has made notable progress in developing its next-generation high-bandwidth memory (HBM4) chips, receiving strong positive feedback from customers on the product’s performance and competitiveness.

Jun Young-hyun, Samsung’s co-CEO and head of the chip division, highlighted in his New Year’s address that HBM4 has been particularly well received, with some clients reportedly stating that “Samsung is back.”

The remarks come as Samsung pushes to reclaim its leadership in advanced memory for artificial intelligence applications.

In October, the company confirmed it was in “close discussions” to supply HBM4 to Nvidia, a key player in the AI hardware market. The South Korean tech giant is racing to narrow its gap with rivals such as SK Hynix, which has recently reported record earnings in the booming AI chip sector.

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